Exclusive: Broadcom expects to sell 1 million 3D stacked chips by 2027

Artificial intelligence chip designer Broadcom said that it expects to sell at least 1 million chips by 2027 based on its stacked design tech, an executive told Reuters on Wednesday.
IEEE

Forecasting Precipitation and Temperature Evolution Patterns Under Climate Change Using a Random Forest Approach With Seasonal Bias Correction

Abstract: The accurate prediction of climate patterns is crucial for effective environmental management and strategic planning, particularly in the face of increasing climate variability and extreme ...
IEEE

Toward Sparse Planar Array Underwater Acoustical Imaging Using Compressive Sensing Pattern Matching Technique

Abstract: 3-D underwater acoustical imaging is an emerging technology used for ocean exploration and underwater vehicle navigation. Achieving high-resolution 3-D imaging is challenging due to the ...
GitHub

SihamPhD/How-to-build-the-best-medical-image-segmentation-algorithm

This is the official code for our paper: How to build the best medical image segmentation algorithm using foundation models: a comprehensive empirical study with Segment Anything Model, where we ...