April 17, 2026 • Do you avoid small talk in the office, or with your neighbor in the elevator? If so, you might want to give it a chance. According to a study just published in the Journal of ...

Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.

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Materials science is an interdisciplinary field concerned with the understanding and application of the properties of matter. Materials scientists study the connections between the underlying ...