HyperLight Introduces 400G-per-lane TFLN PICs on its Chiplet™ Platform for Next-Generation AI InterconnectsBusiness Wire via ITWeb,CAMBRIDGE, Mass., 17 Mar 2026HyperLight Corporation (“HyperLight”), ...

Qin PinLi. Several networking and semiconductor companies revealed new data center solutions during the Optical Fiber ...

HyperLight Corporation ("HyperLight"), creator of the TFLN Chiplet(TM) Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) ...

HyperLight Corporation ("HyperLight"), creator of the TFLN Chiplet™ Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) ...

Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced it will demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026 in Los Angeles, highlighting the company’s ...

OpenLight to Showcase Production Capabilities for AI, Cloud, and High Speed Networking at OFC 2026 SANTA CLARA, CA, ...

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market ...

Implementing strategies that slash laser diode failure rates by at least two orders of magnitude can banish ...

The VCSEL is an indispensable source in modern optoelectronics, where it is valued for its high beam quality, low threshold current, and compatibility with wafer-level processing.

Discusses Photonics Innovation and Data Center Communications at OFC March 17, 2026 4:00 PM EDTCompany ParticipantsPaul Silverstein ...

PLANO, Texas--(BUSINESS WIRE)--Diodes Incorporated (DIODES) (Nasdaq: DIOD) strengthens its power management portfolio with the introduction of the AL8859Q. This automotive-compliant* multi-phase SPI ...