Qin PinLi. Several networking and semiconductor companies revealed new data center solutions during the Optical Fiber ...

HyperLight Corporation ("HyperLight"), creator of the TFLN Chiplet(TM) Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) ...

HyperLight Corporation ("HyperLight"), creator of the TFLN Chiplet(TM) Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) ...

HyperLight Introduces 400G-per-lane TFLN PICs on its Chiplet™ Platform for Next-Generation AI InterconnectsBusiness Wire via ITWeb,CAMBRIDGE, Mass., 17 Mar 2026HyperLight Corporation (“HyperLight”), ...

Coherent Corp. (NYSE: COHR), a global leader in photonics, today announced it will demonstrate multiple co-packaged optics (CPO) technologies at OFC 2026 in Los Angeles, highlighting the company’s ...

MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced the availability of its new 448G PAM4 modulator drivers, designed to accelerate time-to-market ...

Diodes Incorporated has expanded its automotive power management lineup with the launch of the AL8859Q, a multi‑phase ...

Discusses Photonics Innovation and Data Center Communications at OFC March 17, 2026 4:00 PM EDTCompany ParticipantsPaul Silverstein ...

Semtech’s 224-Gbps/lane TIAs and drivers power 800G–3.2T transceivers and optical engines for AI/ML clusters and cloud data centers.

GlobalFoundries (NASDAQ:GFS) used a business webinar focused on silicon photonics and advanced packaging to argue that ...

Empowering Scalable 3.2T/6.4T Scale-Up Optical Connectivity Solutions for the AI Era This optical engine highlights ...