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Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
The first time I paid attention to interconnects in computing systems was during my graduate studies in the early 1990s at the University of Michigan, where I conducted research in parallel computing ...
Production-ready Claude Code plugins for SAP development. Each plugin provides context-aware skills that activate automatically when you work with SAP BTP, CAP, Fiori, ABAP, Analytics, and more. Note: ...
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