Abstract: Demand for chiplet integration using 2.5D or 3D packaging has surged due to the AI/MLdriven growth in computing performance. Universal Chiplet Interconnect Express (UCIe) has been developed ...
Abstract: The Knapsack Problem (KP) continues to be widely used in academic examples and research nowadays. In this paper, we review the KP and compare different solvers based on Quantum Annealing (QA ...
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