HyperLight Corporation, creator of the TFLN Chiplet™ platform, today announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio. The ...
Scientists in China have developed a metasurface platform that realizes true three-dimensional (3D) vectorial holography by ...
Active metadevices integrated with semiconductors. (a) Hybrid silicon-metallic resonators for all-optical ultrafast active metamaterials. (b) Broadband metamaterial frequency switch with femtosecond ...
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