Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly ...

Samsung has reportedly hired a veteran semiconductor engineer who worked for its foundry arch-rival TSMC for almost two decades. Lin Jun-cheng will serve the Korean firm as the senior vice president ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

SANTA CLARA, Calif., Feb. 7, 2025 /PRNewswire/ — LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced ...

Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and ...

TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science and Technology to build an advanced semiconductor packaging platform and ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by the ...

Institutional participation has drawn attention to a semiconductor platform developer involved in advanced manufacturing technologies. Activity from asset managers reflects broader interest across ...