The main objective of this project is to let students apply the image processing techniques that been taught in class in a given conditions based on their title. This particular project involved the ...

Board manufacturers are boosting their investment in inspection, test and analytics to meet the increasingly stringent demands for reliability in safety-critical sectors like automotive. This ...

Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...

The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...

Photo-induced force microscopy (PiFM) is a sophisticated nanoscale characterization approach that combines the elevated spatial resolution of atomic force microscopy (AFM) with infrared (IR) ...

As loss of access grows, it�s time to look into viable alternatives to AOI. Rapid changes in printed circuit board (PCB) assemblies will force manufacturers to modify their test and inspection ...