Engineers use a redistribution layer (RDL) in flip-chip designs to redistribute I/O pads to bump pads without changing the I/O pad placement. However, traditional routing capacity may be insufficient ...
Yield is a much bigger issue when it comes to panel-level packages, which may contain up to 24 RDL layers. Just finding the defects is a massive challenge, let alone understanding how they will impact ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
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