This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...

Samsung Electronics to Integrate 'Exynos' into Galaxy Z Flip 8Samsung Electronics' Mobile eXperience (MX) division is ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

New leaks reveal the Galaxy Z Flip 8 will feature the 2nm Exynos 2600 chip, with Samsung setting a new foldable processor ...

Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST’s strategic initiative on ...

The Galaxy Z Flip 7 FE has appeared on Geekbench, confirming it will use an Exynos 2400-series chip (likely the underclocked 2400e). This is the same processor found in the Samsung Galaxy S24 FE.

Samsung is reportedly collaborating with Qualcomm to develop a customized version of the Snapdragon 8 Elite Gen 5 chip, using Samsung’s advanced 2-nanometer SF2 process. This partnership aims to ...

Samsung's next flip smartphone, the Galaxy Z Flip 8 is tipped to come powered by the newly launched Exynos 2600 processor.

Samsung is considering using the Exynos 2600 chip in the Galaxy Z Flip 8, aiming to boost AI performance, cut costs, and strengthen its semiconductor business. The post Samsung may power Galaxy Z Flip ...

Samsung appears ready to double down on its in-house chip strategy, with new reports suggesting that the Galaxy Z Flip 8 could once again ship exclusively with an Exynos processor when it launches in ...