New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...

Since GSM modems have been equipped with a GPS receiver and a micro-controller, they offer unlimited application opportunities with lower procurement costs and shorter development times. Navigation, ...

Cervoz will showcase industrial storage, memory, and connectivity solutions designed for the performance and reliability requirements of embedded and industrial edge AI systems with stable, real-time ...