Electronic Design

Component Line Meets Preliminary XFP Specification

The company’s line of components, which includes an interface connector, transceiver-cage assembly, and a heatsink assembly, is designed to conform to the preliminary XFP specification by the ...
Electronic Design

Component Suppliers: Know These New OEM Requirements for Standardized Electronic Documentation

Inefficiencies for OEMs to use PDF-only datasheet documentation of integrated circuits. Standards that address electronic documentation for I 2 C, SPMI, SPI, and JTAG devices. ROI: Faster volume sales ...
Electronics Weekly

Space design: Rad-hard and integrated – a space component checklist

Designing electronic boards for use in space can be hindered by radiation, a vacuum environment and cost, write Thibault Brunet, Salvo Pappalardo and Ferdinando Tonicello. The design of electronics ...
New Electronics

PICMG to develop new modular box PC open specification

PICMG, a consortium for developing open embedded computing specifications, has established a technical subcommittee to create a new PICMG form factor specification named ModBlox7. This specification ...
Design-Reuse

Hynix Semiconductor, LG Electronics, Samsung Electronics and Silicon Image Sign Long-Term Agreement to Create the Next-Generation Memory Interface Technology Specification

Companies Will Jointly Promote Serial Port Memory Technology ForBroad Market Adoption As An Industry Standard SUNNYVALE, Calif. -- May 18, 2009-- Hynix Semiconductor, Inc. , LG Electronics, Samsung ...