Ericsson extends its 3E digital power module family with two digital-communication-bus-enabled 540-648W low-profile quarter-brick Power Interface Modules. Ericsson has extended its 3E digital power ...
CENTENNIAL, Colo.--(BUSINESS WIRE)--Global technology solutions provider Arrow Electronics, Inc. (NYSE:ARW) has introduced a family of plug-and-play camera modules based on sensor technology from ...
A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...
Recent years have shown rapid growth in electronic modules, revealing them as engineering go-to solutions for the development of various electronic devices and systems. The primary advantages of ...
Industrial digital input chips provide serialized data by default. However, in systems that require real time, low latency, or higher speed, it may be preferable to provide level-translated, real-time ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
This file type includes high resolution graphics and schematics when applicable. Using the M.2 interface to connect high-speed modules to a motherboard has become something of a trend. This space is ...
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