Scientists at Caltech have figured out how to precisely engineer tiny three-dimensional (3D) metallic pieces with nanoscale ...

New 2025 data reveals rising vehicle defects, increased software failures, and lower driver satisfaction, reshaping how ...

Unravelling the relationships between defects and material properties is a daunting task, but increased analysis and knowledge could be beneficial in many applications. Solid inorganic materials ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this technology can be used in production. One lingering issue that ...