For a long time, semiconductor defect inspection focused on particles, and particle defects remain an important cause of yield loss. But as devices have become more complex, additional kinds of ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

Some industry sectors such as automotive and medical continue to push for higher and higher reliability levels; however, many fabs are having difficulties achieving them. Current inspection regimes ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...