A multilayer technology developed by substrate manufacturer Lamina Ceramics (Westampton, NJ) enables unfired ceramic to be bonded to either Kovar or copper-molybdenum-copper (CuMoCu) metal. Offering ...
A new method of nickel-gold plating uses chemicals rather than the more-commonly used electricity-based approach of passing electric current between a substrate and conductive solution. The new ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
(Nanowerk News) In recent times, humans have faced the threats of global warming and depletion of energy resources. In Japan, about 40% of the greenhouse gases generated due to energy consumption are ...
Taiwan-based Leatec Fine Ceramics, a dedicated maker of aluminum and ceramic substrates needed for manufacturing chip resistors, is mulling raising its quotes in the wake of a recent 15% price hike ...
Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...
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