Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus. The Atalla ...

Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now ...

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where ...

MOUNTAIN VIEW, Calif.--(BUSINESS WIRE)--Diamond Quanta today announced Adamantine Thermal™, an engineered-diamond thermal platform designed for integration into advanced packaging workflows and ...

The International Test Conference is the electronic industry’s premier event dedicated to the testing of devices, boards, and systems, from design verification to final testing. At this year’s version ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

KLA Corporation KLAC is scaling its advanced packaging business as demand rises for High-Bandwidth Memory (HBM) and advanced logic nodes to support AI workloads. KLAC’s inspection and metrology tools ...

Bruker Corporation BRKR recently announced the shipment and installation of its 15th InSight WLI 3D optical metrology system for a leading semiconductor manufacturer. The installation is part of a ...

HANOI, Vietnam, Jan. 29, 2026 /PRNewswire/ --On January 28, 2026, in Hanoi, FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming ...