The EP21FL two-part epoxy-resin system features low to moderate viscosity and is suitable for potting, coating, and sealing electronic assemblies. It is said to excel at bonding dissimilar substrates ...
EP21FL is a toughened, low-to-moderate viscosity, two-part epoxy. EP21FL two-part epoxy resin works between -60 and 250ºF and resists thermal cycling and shock. Typical viscosity at 25°C is 4,000 cps ...
Epoxy resin formulations can be cured using a variety of curing agent (hardener) chemistries, each offering distinct advantages. Common options include amines, anhydrides, dicyandiamides, dihydrazides ...
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